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Simulation of Semiconductor Processes and Devices 2007 : Sispad 2007 (Hardcover)

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Product Overview

This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.

Specifications

Publisher Springer Verlag Wien
Mfg Part# 9783211728604
SKU 204869367
Format Hardcover
ISBN10 3211728600
Release Date 9/8/2009
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